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技術研發單位
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    • Monolithic hybrid type quantum dots micro-light-emitting diodes for the full-color pixel array

      Electronic & Optoelectronics FutureTech Monolithic hybrid type quantum dots micro-light-emitting diodes for the full-color pixel array

      A wavelength tunable micro-light-emitting diodes fabricated by the nanometer-level etching technology, the strain-induced engineering can effectively shift the emission wavelength from green to blue. Meanwhile, we introduced the ALD for the passivation layer,the super inkjet printing system used to form the color-conversion layer to emissive red light. Finally, a hybrid type full-color micro-LED has been fabricated with the monolithic epitaxial wafer.
    • Embedded Smart Textile Arrays Display Module

      Electronic & Optoelectronics FutureTech Embedded Smart Textile Arrays Display Module

      National Taipei University of Technology (NTUT) announces the latest approach“embedded smart textiles arrays display module” (ESTAD module) . The ESTAD module involves twoparts,one is circuitthe other is control box. The circuit is to attach the fabric seamlessly,this could be twistedrubbed to fit various design. The control box is designed smaller than the current form to put in the pocketsomewhere hidden in the potential application.
    • Ultra-Low Frequency Raman Spectroscopy Technology

      Electronic & Optoelectronics FutureTech Ultra-Low Frequency Raman Spectroscopy Technology

      ULF Raman spectroscopy utilizes novel VHG filters to spectrally clean up the laser line before ULF Raman spectroscopy is measured with a single grating spectrometer in conjunction with CCD camera. The availabilityaccessibility of UFL Raman spectroscopy opens new opportunity to reveal key information such as intermolecular structure characterization, pharmaceutical polymorph identification,material phaseinterfacial structure determination.
    • Neuromorphic Intelligent Visual System for Low-Power Edge Devices

      AI & IOT Application FutureTech Neuromorphic Intelligent Visual System for Low-Power Edge Devices

      1.Low-Power Processing-in-sensor CMOS Image Sensor 2.Implementation of Low-PowerLow-Latency Deep Learning Chip based on Neuromorphic Intelligence (collaborated with MOST 108-2622-8-007-009) 3.Development of Neuromorphic Chip based on The Fruit Fly VisualSpatial Sensory Systems 4.Hardware-Software Co-Design for Neuromorphic AI Chips
    • Platform for SiC Power System on a Chip

      Electronic & Optoelectronics FutureTech Platform for SiC Power System on a Chip

      Develop a SiC single-chip power system platform across processes, devices,circuits to breakthrough the temperaturepower constraints of Si applications. The research includes low-voltage CMOS logic circuits, high-voltage driver circuits,vertical super-junction MOSFETs. All specifications exceed existing technology. The results can be applied to energy networks, rail transit, new energy vehicles, geological exploration, aerospace, defenseother fields.
    • Electromagnetic Engineering Surface

      Electronic & Optoelectronics Innotech Expo Electromagnetic Engineering Surface

      To solve the low transmission ratedisruption caused by the non-line of sightmulti-path transmission in indooroutdoor environment, a special electromagnetic surface is designed to guide the beam to the desired area with multiple reflections.
    • Energy-saving GlassMethod of Manufacturing the Same

      Electronic & Optoelectronics Innotech Expo Energy-saving GlassMethod of Manufacturing the Same

      Energy-saving glass is realized using nano-imprinting to fabricate a periodic nano-structures. The glass can suppress the transmission of ultraviolet light such that people are not harmed. The transmission of infrared is largely reduced to lower air-conditioning. On the other hand, transmission is not deteriorated in the visible range to prevent the increment of illumination cost.
    • Filter componentsbandpass filtering circuit of bandpass filter

      Electronic & Optoelectronics Innotech Expo Filter componentsbandpass filtering circuit of bandpass filter

      An equivalent LC model is developed to emulate the filter performanceto accelerate the design procedure. The source-load coupling renders this filter a cross-coupling effect which creates two transmission zeros by the passband edges for the signal selectivity enhancement.
    • Balanced bandpass filter design using the folded substrate integrated waveguide

      Electronic & Optoelectronics Innotech Expo Balanced bandpass filter design using the folded substrate integrated waveguide

      A novel balanced BPF using the folded half-mode substrate integrated waveguide has a central frequency of 4.65 GHz with 0.55 GHz BWin-band insertion loss of 2.2 dB. The size of an FHMSIW is about 1/4 of the substrate integrated waveguide (SIW). The common-mode rejection levels are greater than 40 dB over a wide frequency range.
    • Coplanar-Waveguide Defected Ground Structure

      Electronic & Optoelectronics Innotech Expo Coplanar-Waveguide Defected Ground Structure

      A coplanar-waveguide defected ground structure is invented for signal filtering of communication systems. The performance of the coplanar-waveguide defected ground structure can be easily determined by the design of the simple ground defects. It demonstrates excellent passband stopband, leakage wave,slow wave characteristics.
    • QUANTUM DOTS DISPLAY DEVICE

      Electronic & Optoelectronics Innotech Expo QUANTUM DOTS DISPLAY DEVICE

      The present invention aims to develop of novel wavelength converting films with the composited perovskite quantum dots,facilitating the application of this technology for LED backlight module.We applying PQD on chip to the components of LED backlight modules. The PQD-LEDs that are used for the backlight transmitted through a color filter exhibit the ITU-R Recommendation BT.2020 approximately 90
    • High Precision Maskless Lithography System for Advanced IC SubstratesPackaging

      Electronic & Optoelectronics Innotech Expo High Precision Maskless Lithography System for Advanced IC SubstratesPackaging

      This project develops a high-precision maskless lithography system consists of digital light processing, microlens / spatial filters arrays,precision servo-controlled motion technologies. Based on this maskless UV lithographic system, we are able to achieve UV patterning of arbitrarycomplicated 2D/3D microstructures for advanced IC substratepackaging.
    • Fabrication of Seamless Roller Molds by Fiber ArrayDigital Light Processing

      Electronic & Optoelectronics Innotech Expo Fabrication of Seamless Roller Molds by Fiber ArrayDigital Light Processing

      This research develops an innovative method for patterning arbitrarycomplicated 3D microstructures on metallic roller surfaces. This roller mold manufacturing system consists of digital light processing, arrayed microlensesoptical fibers,precision servo-controlled motion technologies. Based on this arrayed UV beam pen system, seamless roller molds are fabricated for roller imprintin
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