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Technical category
技術研發單位
    • Fabrication of Seamless Roller Molds by Fiber ArrayDigital Light Processing

      Electronic & Optoelectronics Innotech Expo Fabrication of Seamless Roller Molds by Fiber ArrayDigital Light Processing

      This research develops an innovative method for patterning arbitrarycomplicated 3D microstructures on metallic roller surfaces. This roller mold manufacturing system consists of digital light processing, arrayed microlensesoptical fibers,precision servo-controlled motion technologies. Based on this arrayed UV beam pen system, seamless roller molds are fabricated for roller imprintin
    • High Precision Maskless Lithography System for Advanced IC SubstratesPackaging

      Electronic & Optoelectronics Innotech Expo High Precision Maskless Lithography System for Advanced IC SubstratesPackaging

      This project develops a high-precision maskless lithography system consists of digital light processing, microlens / spatial filters arrays,precision servo-controlled motion technologies. Based on this maskless UV lithographic system, we are able to achieve UV patterning of arbitrarycomplicated 2D/3D microstructures for advanced IC substratepackaging.
    • Balanced bandpass filter design using the folded substrate integrated waveguide

      Electronic & Optoelectronics Innotech Expo Balanced bandpass filter design using the folded substrate integrated waveguide

      A novel balanced BPF using the folded half-mode substrate integrated waveguide has a central frequency of 4.65 GHz with 0.55 GHz BWin-band insertion loss of 2.2 dB. The size of an FHMSIW is about 1/4 of the substrate integrated waveguide (SIW). The common-mode rejection levels are greater than 40 dB over a wide frequency range.
    • Filter componentsbandpass filtering circuit of bandpass filter

      Electronic & Optoelectronics Innotech Expo Filter componentsbandpass filtering circuit of bandpass filter

      An equivalent LC model is developed to emulate the filter performanceto accelerate the design procedure. The source-load coupling renders this filter a cross-coupling effect which creates two transmission zeros by the passband edges for the signal selectivity enhancement.
    • QUANTUM DOTS DISPLAY DEVICE

      Electronic & Optoelectronics Innotech Expo QUANTUM DOTS DISPLAY DEVICE

      The present invention aims to develop of novel wavelength converting films with the composited perovskite quantum dots,facilitating the application of this technology for LED backlight module.We applying PQD on chip to the components of LED backlight modules. The PQD-LEDs that are used for the backlight transmitted through a color filter exhibit the ITU-R Recommendation BT.2020 approximately 90
    • Coplanar-Waveguide Defected Ground Structure

      Electronic & Optoelectronics Innotech Expo Coplanar-Waveguide Defected Ground Structure

      A coplanar-waveguide defected ground structure is invented for signal filtering of communication systems. The performance of the coplanar-waveguide defected ground structure can be easily determined by the design of the simple ground defects. It demonstrates excellent passband stopband, leakage wave,slow wave characteristics.
    • Electromagnetic Engineering Surface

      Electronic & Optoelectronics Innotech Expo Electromagnetic Engineering Surface

      To solve the low transmission ratedisruption caused by the non-line of sightmulti-path transmission in indooroutdoor environment, a special electromagnetic surface is designed to guide the beam to the desired area with multiple reflections.
    • Platform for SiC Power System on a Chip

      Electronic & Optoelectronics FutureTech Platform for SiC Power System on a Chip

      Develop a SiC single-chip power system platform across processes, devices,circuits to breakthrough the temperaturepower constraints of Si applications. The research includes low-voltage CMOS logic circuits, high-voltage driver circuits,vertical super-junction MOSFETs. All specifications exceed existing technology. The results can be applied to energy networks, rail transit, new energy vehicles, geological exploration, aerospace, defenseother fields.
    • Ultra-Low Frequency Raman Spectroscopy Technology

      Electronic & Optoelectronics FutureTech Ultra-Low Frequency Raman Spectroscopy Technology

      ULF Raman spectroscopy utilizes novel VHG filters to spectrally clean up the laser line before ULF Raman spectroscopy is measured with a single grating spectrometer in conjunction with CCD camera. The availabilityaccessibility of UFL Raman spectroscopy opens new opportunity to reveal key information such as intermolecular structure characterization, pharmaceutical polymorph identification,material phaseinterfacial structure determination.
    • Embedded Smart Textile Arrays Display Module

      Electronic & Optoelectronics FutureTech Embedded Smart Textile Arrays Display Module

      National Taipei University of Technology (NTUT) announces the latest approach“embedded smart textiles arrays display module” (ESTAD module) . The ESTAD module involves twoparts,one is circuitthe other is control box. The circuit is to attach the fabric seamlessly,this could be twistedrubbed to fit various design. The control box is designed smaller than the current form to put in the pocketsomewhere hidden in the potential application.
    • Monolithic hybrid type quantum dots micro-light-emitting diodes for the full-color pixel array

      Electronic & Optoelectronics FutureTech Monolithic hybrid type quantum dots micro-light-emitting diodes for the full-color pixel array

      A wavelength tunable micro-light-emitting diodes fabricated by the nanometer-level etching technology, the strain-induced engineering can effectively shift the emission wavelength from green to blue. Meanwhile, we introduced the ALD for the passivation layer,the super inkjet printing system used to form the color-conversion layer to emissive red light. Finally, a hybrid type full-color micro-LED has been fabricated with the monolithic epitaxial wafer.
    • On-chip integrated quantum polarization-entangled optical source

      Electronic & Optoelectronics FutureTech On-chip integrated quantum polarization-entangled optical source

      We developed a unique integrated quantum polarization entangled light source, in addition to generating a quantum polarization entangled photon pair, the integrated quantum chip also utilizes a special adiabatic optical light transfer array to integrate the on-chip polarization-dependent spectral splitting via the quantum tunneling effect. The integrated quantum light source provides a stable polarization entangled source for the more quantum applications.
    • Innovative Wireless PositioningTracking System

      Electronic & Optoelectronics FutureTech Innovative Wireless PositioningTracking System

      iTech has developed an Innovative Wireless Positioning&Tracking System. iShield can simultaneously detect drones & operators. iPosition tracks thousands of targets indoor. iFollow is an auto-following function for smart droids.
    • Panchromatic CMOS TDI Image Sensor Design for Remote Sensing Satellite

      Electronic & Optoelectronics FutureTech Panchromatic CMOS TDI Image Sensor Design for Remote Sensing Satellite

      This project developed a CMOS Image Sensor (CIS) for the 2nd generation remote sensing satellite,its main achievement is to improve the ground resolution (also known as the Ground Sampling Distance, GSD) from 2 meters to sub-meter. The 12-cm large size chip of CMOS image sensor is implemented using Back-Side Illumination (BSI) CIS technology with mask stitching technologyutilizing the CMOS Time Delay Integration (CMOS TDI) technology in this design.
    • Compact Ionospheric Probe

      Electronic & Optoelectronics FutureTech Compact Ionospheric Probe

      Compact Ionospheric Probe (CIP) is an all-in-one plasma sensor to optimizely install on CubeSat platform with sampling rate up to 1,024 S/s to measure ionospheric plasma concentrations, velocities,temperatures over a wide range of spatial scales in a time-sharing way.
    • GaN Based High-frequency High-efficiency Converter

      Electronic & Optoelectronics FutureTech GaN Based High-frequency High-efficiency Converter

      A high power converter application built with GaN HEMT was presented. The technical aspects are developed from 6-inch wafers to converter applications, covering the optimization of 6-inch GaN epitaxial layers. The processdevice model of the 6-inch GaN E/D-mode component was established. Low-side GaN HEMT logic gates ( 2MHz) for integrated circuit were designed. Finally, The high-frequency LLC resonant converter is completed.
    • High-Security IC Test Technology with Dynamic Keys

      Electronic & Optoelectronics FutureTech High-Security IC Test Technology with Dynamic Keys

      We proposed a dynamic-key secure DFT structure that can generate the keys dynamicallydefend scan-basedmemory attacks without decreasing the system performancethe testability. Analysis results show that our method can achieve a very high security levelthe security level will not decrease no matter how many times the attacker guesses due to the dynamic characteristic of our method.
    • Superconducting-quantum-bit simulation chip (SC-qubit simulation chip)

      Electronic & Optoelectronics FutureTech Superconducting-quantum-bit simulation chip (SC-qubit simulation chip)

      Superconducting qubit is the basic structure for constructing the quantum computer in the current approach. The superconducting-quantum-bit simulation chips (SC-qubit chip) that consist of 1-4 qubits are manufactured locally by domestic researchers. The SC-qubit chip is designed for simulation of artificial atoms, their mutual interactionstheir interactions with microwavesvacuum fluctuations.
    • MethodStructure of stacking 3D-IC Employing Controlled-Grain Semiconductor Film

      Electronic & Optoelectronics FutureTech MethodStructure of stacking 3D-IC Employing Controlled-Grain Semiconductor Film

      The location of controlled-grain Si island is determined by the pattern of “cooling holes”. The grain size is determined by the distance between “holes” due to lateral grain growth using pulse laser crystallization. This predictability allows the transistorscircuits to stay away from the grain boundaries for monolithic
    • Table-top ATTO-EUV laser source

      Electronic & Optoelectronics FutureTech Table-top ATTO-EUV laser source

      Prof. Chen's research team at IPT NTHU achieved a breakthrough to build table-top coherent EUV light source. This new accessiblereliable EUV light source makes a lot of the first possibilities, enabling the dynamics of chemical reactions, nano-materialsbio-molecular systems to be studied with unprecedented temporalspatial resolution, e.g. coherent 13.5nm EUV light source for nm-scale defect inspection.
    • In-situ Large-scale X-ray Mirror Measurement Technology

      Electronic & Optoelectronics FutureTech In-situ Large-scale X-ray Mirror Measurement Technology

      The long trace profiler (LTP) can be used to measure the figureintermediate frequency roughness of an X-ray mirror. The measurement process is accurate, high-speednon-contact. The radius of curvature for the measurement may be ranged from a value from 5 m to infinity, such that the surface profile feature can be measured in the range with a longitudinal resolution of 0.15 nm.
    • Vacuum Functional Coating Technology

      Electronic & Optoelectronics FutureTech Vacuum Functional Coating Technology

      Here we prepare a non-evaporative getter (NEG) film using magnetron sputtering. A vacuum chamber with a sputtered NEG film can maintain ultra-high vacuum (-10 Torr level) without any pump after activation. The activation temperature can be controlled below 200 °C according to different process conditions. The activated NEG film adsorbs residual gases in the vacuum system to achieve the UHV.
    • Photon Generation in Magic School

      Electronic & Optoelectronics FutureTech Photon Generation in Magic School

      NSRRC, which is one of the worldwide top magnet related design teams, is capable of the magnetic field simulation, mechanism designmagnetic field measurement. Related technologies include electromagnet technology, permanent magnet technology, vacuum technology, low temperature technologysuperconductivity technology.
    • Ubiquitous RF Energy Applications

      Electronic & Optoelectronics FutureTech Ubiquitous RF Energy Applications

      A huge microwave power/RF power, which is generated by reasonable number super-imposition of smaller-power solid-state power sources, becomes a future trend. To meet the trend, NSRRC has developed a technology to combines multiple kilowatt-level RF power sources to tens of kilowatts to replace the vacuum tube that needs a high-voltage power supplybecome moremore expensive.
    • An 1.6Tb/s Silicon Photonics Chip

      Electronic & Optoelectronics FutureTech An 1.6Tb/s Silicon Photonics Chip

      This 1.6Tb/s silicon photonic chip adopts the semiconductor technology to integrated optical couplers, splitters, modulators, and 4x16 AWG optical multiplexer into a 5mm x 5mm area. Thanks to the support of Ministry of Science and Technology (MOST) and Taiwan Semiconductor Research Institute (TSRI), this novel 1.6Tb/s silicon photonics chip is designed at the end of 2018 and send to IMEC to produce. After getting the chip at the beginning of 2020, those separate devices of optical edge coupler, optical splitter, optical modulator, and 4x16 AWG optical multiplexer have been measured and verified. The overall chip performance has also been checked by injecting lasers and the light signal has been coupled by singlemode fiber to demonstrate the feasibility of this novel silicon photonics chip.
    • Satellite Remote Sensing of Aerosol Profile in 3D PM2.5 Construction for Regional Air Pollution Monitoring

      Electronic & Optoelectronics FutureTech Satellite Remote Sensing of Aerosol Profile in 3D PM2.5 Construction for Regional Air Pollution Monitoring

      Concerning the uncertainty of assuming well-mixed aerosols within the planetary boundary layer, a sensible aerosol vertical distribution described by a log-normal fitting function is proposed to provide more realistic single-peak extinction profile with a decadal MPL in situ dataset. The performance of fitted single-peak aerosol profiles can reach up 0.8973 of correlation coefficient when considering the seasonal variations in PBLH and the surface layer height of well-mixed aerosols. Eventually, not only the aerosol extinction profile but also the 3-dimensional distribution are promising to be created from satellite AOD retrieval with PBLH information for providing accurate PM2.5 monitoring over a regional scale.
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