Technical Name Atomic layer technologies for advanced materialsmodules
Project Operator National Taiwan University
Project Host 陳敏璋
Summary With rapid evolution of Moores lawsemiconductor technology nodes down to sub-10 nm, advanced devicematerial technologies capable of Å accuracy are highly demanded. Thus we developed atomic layer technologies including atomic layer deposition, atomic layer annealing, atomic layer epitaxy,atomic layer etching, etc. for extreme control of materialsstructures with Å precision.
Scientific Breakthrough (1).Atomic layer annealing (ALA): Improvement of dielectric constant, leakage current,interfacial state density of high-K gate dielectrics. (2).Atomic layer epitaxy (ALEp): High-quality GaNAlN heteroepitaxy at a low growth temperature of only 300°C. (3).Atomic layer etching (ALEt): Self-limiting, self-stop, highly conformal, damage-free,layer-by-layer etching with Å scale accuracy.
Industrial Applicability It is expected that the atomic layer technologies, including atomic layer deposition, atomic layer annealing, atomic layer epitaxy,atomic layer etching, etc. for advanced materialsmodules, will become key technologies for precise manufacture in sub-10 nm semiconductor technology nodesother related industries in the near future.
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